Solder

A soldering binder with a flux produced in the first melting of tin and lead in accordance with the PN EN 29453: 2000 standard, in a continuous process of casting without air access, then squeezed, which ensures the elimination of oxides. A binder thickness 0.5 mm and weight 100 g, with tin content in the product within: 59.5% to 60.5%, and melting temperature in the range: 183 ° C to 190 ° C. The SW26 flux is made on the basis of calaphony and an organic halogen activator, which after soldering is "tied" in calaphonia, which means that there is no direct contact with the solder and does not cause corrosion, and also facilitates melting and increases the liquidity of solder. The soldering binder is mainly used in the electronic industry, for the production of standard electronic devices and components, electrical engineering. Placed in a comfortable vial. Characteristics: Diameter fi 1.00mm length approx. 3 meters of tin and lead SN60PB40, multi -core wire with SW26 SW26 SPOOD.